Application System
Laser Processing
Scan Optical System and Focusing Optical System
For the maskless processing, it can do direct drawing processing on the basis of the data like CAD.
It is usually classified as scan optical system and focusing optical system.
(There is also a hybrid scanning that combines both).
Scan optical system | Focusing optical system | |
Scanning method | Galvano scan | Stage scan |
Scanning speed | high | low |
Scanning area | narrow | wide |
Focusing method | fθLens | Objective Lens |
Focusing spot diameter | few 10μ - few 100μ | submicron - few 10μ |
Death of focus | deep | shallow |
Scan Type
Focusing System (with Observation System)
Laser Processing Systems
Shutter for High Power Laser

Safely interrupt the optical path by the highpower
laser mirror and beam.
laser mirror and beam.
Specifications
Part Number | SHPS-▢▢ |
S$ | 5,250 |
Wavelengths [ nm ] | 266、355、532、1064 |
Clear aperture [ mm ] | Φ8 |
Corresponding Output | about 20W |
Laser Damage Threshold | 5J/cm2 (@266nm) - 28J/cm2 (@1064nm) |
On-Off Speed | about 200ms |
Variable Attenuator

Light quantity of the high-power laser can be
continuously variable by PBS and wavelength plate
continuously variable by PBS and wavelength plate
Specifications
Part Number | SVAB-▢▢A-O8 |
S$ | 4,525 |
Wavelengths [ nm ] | 266、355、532、1064 |
Clear aperture [ mm ] | Φ4 |
Corresponding Output | 20W |
Laser Damage Threshold | 1.0J/cm2 (@266nm) - 5.1J/cm2(@1064nm) |
Transmission Range | 2 - 93% (@532nm) |
Laser Beam Expander Unit

By lens configuration of the air gap, it is possible to correspond to
high-power laser and be strict collimation adjustment
in diopter correction mechanism.
high-power laser and be strict collimation adjustment
in diopter correction mechanism.
Specifications
Part Number | BE/LBED series |
S$ | 525〜 |
Wavelengths [ nm ] | 266、355、400〜700、1064 |
Laser Damage Threshold | 1.4J/cm2 (@266nm) - 4J/cm2(@1064nm) |
Magnification | ×2 - ×21 (@400 - 700nm) |
Incident Clear Aperture[ mm ] | φ1.7 |
Auto Focus Unit

By built-in laser sensor, it enables high-speed
tracking even for transparent object such as
films or glasses.
tracking even for transparent object such as
films or glasses.
Specifications
Part Number | TAF-SS-OBL-3 |
S$ | Contact Us |
Objective Lens | 2× - 100× |
Camera | C-mount CCD camera (element size 2/3″ or less) |
Travel | 3mm |
Trace Range (Track Range) |
2×, 5×, 10× : ±1.5mm 20× : ±500μm 50× : ±250μm 100× : ±100μm |
Repeatability (Focus) |
±6.0μm (5×), ±1.0μm (10×), ±0.5μm (20×, 50×, 100×) |
Surface Accuracy Guarantee Mirror

Guaranteed surface accuracy in integrated holder,
ideal for built-in locking mechanism
ideal for built-in locking mechanism
Barrel Unit + Laser Introduction Block

Observation barrel of optimal coaxial epi-illumination
for the positioning of the micro-machining
for the positioning of the micro-machining
Galvano Unit

Drawing high speed laser of high quality reducing the jitter and wobble
* it is available to assembly for each company’s galvanometer.
Please contact to our international sales division.